39-ICH08_ASEC膠水 衡鵬供應
ASEC 39-ICH08_underfill use for low temperature solder Package.This product which balanced curing agent. It is possible to obtain characteristic of both LOW CTE and LOW TEMP CURING.
39-ICH08_ASEC膠水特長：
Liquid state
Property Typical Value Test Condition
Chemical Epoxy (Black)
Specific Gravity1.4 @25度
Thixotropic index1.0 12s-1/120s-1
Viscosity 4.200 mPa·s Cone plate type, 120s-1
Cured state
Property Typical Value Test Condition
Tensile Modulus 4.6 Gpa 25度, DMA
Tg 120度 DMS
CTE α1/α2 39/105 ppm/度 TMA
Tensile shear strength16 Mpa JIS K 6850
Volume resistivity2.28 x 1015Ω·cm JIS K 6911
Surface resistivity9.7 x 1015Ω JIS K 6911
Dielectric constant3.08 1.0GHz 3.05 2.45GHz
Dielectric loss tangent0.015 1.0GHz 0.015 2.45GHz
