GTS100AH-N（平面式高速固晶機(jī)）
（周期：50ms）
適用于2121,3014及2835,5050等
一、機(jī)型特性
1.采用國(guó)際領(lǐng)先的雙固晶，雙點(diǎn)膠，雙晶片搜尋系統(tǒng)；
2.采用直驅(qū)電機(jī)驅(qū)動(dòng)邦頭；
3.采用線性電機(jī)驅(qū)動(dòng)搜尋晶片平臺(tái)（X/Y）與送料平臺(tái)（B/C）；
4.采用可程式恒溫點(diǎn)膠系統(tǒng)；
5.采用真空漏晶檢測(cè)；
6.支架采用疊片式上料（免裝料盒），有效提高了生產(chǎn)效率；
7.工控機(jī)控制設(shè)備運(yùn)行，簡(jiǎn)化了自動(dòng)化設(shè)備的操作；
8.精準(zhǔn)的自動(dòng)化設(shè)備為企業(yè)提高生產(chǎn)效率，降低成本提供了有效保障，從而切實(shí)有效地提高了企業(yè)競(jìng)爭(zhēng)力；
9.精準(zhǔn)的固晶位置及優(yōu)良的一致性為后道工序提供了先天的保障。
GTS100AH-N
Plane-type High-speed Die Bonder
Cycle: 50ms
It is compatible with 2121、3014、2835 and 5050 etc.
Product Features
1. International leading double die bond, double adhesive dispense and double die searching system;
2. Linear motor is applied to drive bond head;
3. Linear motor will drive the die to search corresponding platform(X/Y) and corresponding loading platform (B/C);
4. Programmed control constant-temperature adhesive dispensing system is also applied;
5. Vacuum die missing testing technology is adopted;
6. Stacking holders for loading (free-loading magazine) is applied to improve the production efficiency largely;
7. IPC will control the operation of equipment, simplifying the operation of automation equipment;
8. Sophisticated equipment will help improve your enterprise’s production efficiency and reduce relevant costs so as to provide effective guarantee and enhance the enterprise’s competitiveness;
9. Precise die bond location and excellent compatibility will guarantee the back-end processing.
